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RIEGL will be attending and exhibiting at AGU 2019

By Eric Van Rees - 4th December 2019 - 06:47

The American Geophysical Union 2019 (AGU 2019) conference will be taking place from December 9-13, 2019, at the Moscone Center in San Francisco, California.

RIEGL will be exhibiting at Booth 1514 during AGU 2019. Be sure to stop by our booth to learn about the latest developments in RIEGL Waveform-LiDAR technology including our fast-TLS solutions and how we can help you and your business needs.

Stop by throughout the week to see our fast-TLS instrument, the RIEGL VZ-400i, on display.

The VZ-400i is a 3D laser scanning system which combines an innovative new processing architecture, internet connectivity, and a suite of MEMS sensors with RIEGL’s latest waveform processing LiDAR technology.

Read More: Laser Scanning Environmental

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