The 1280 × 1024 Boson SX8 and Boson SX8-CZ 15–75 deliver optimized size, weight, and power with high-performance thermal imaging.
Teledyne FLIR OEM, a business unit of Teledyne Technologies Incorporated, announced the release of the ITAR-free Boson SX8, the first NDAA-compliant, volume production, uncooled longwave infrared (LWIR) thermal camera module to combine an 8-micron pixel pitch with SXGA (1280 × 1024) resolution. The stateof-the-art 8-micron pixel enables industry-best thermal performance and four times the resolution of today’s high-volume, uncooled VGA (640 × 512) thermal camera modules, all within a similarly sized compact package.
Designed for high-performance and optimized for size, weight, and power (SWaP) constrained defense and industrial applications, the Boson SX8 family enables integrators and operators to see more, see farther, and deploy high-performance thermal imaging at production scale.
Critical for uncrewed aircraft systems (UAS), counter-UAS, perimeter security, handheld devices, seekers, visual augmentation, and intelligence, surveillance, and reconnaissance (ISR) systems, the Boson SX8 family delivers performance previously available only in heavier, larger, and more power-hungry cooled, midwave infrared (MWIR) thermal imaging systems.
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